This is the 11th edition of the Solutions Datacenter Management and Cloud Computing Worldexpo fairs, which, for the occasion, are merging; the problems linked to infrastructures being more and more interconnected, in particular with the mass arrival in the daily lives of Internet of Things (IoT) users.
Rosenberger OSI will present the new evolution of its modular panels to support ever-increasing densities (72, 96 and tomorrow 216 ports on 1 HU) thanks to its lines of panels SMAP-G2 HD, SMAP-G2 UHD, Data Center Panel as well as its brand new SEDECIM cabling system for the 400GBASE-SR8. Because increasing densities have not only an impact on the patch panels but also on the whole cabling infrastructure.
Come and discover the future of cabling infrastructures for data centers, come and meet us on our booth number D25-29.
Request your free VIP ticket from us. We look forward to your participation.